SYGEF Ultra

SYGEF Ultra is an optimal solution for the efficient transport of (H)UPW for the most advanced process technologies (<10nm down to physical limits). Engineered for next-generation semiconductor demands, it is future-ready for the angstrom era, supporting both hot and ambient ultrapure water applications. Its high purity material properties and chemical resistance make it ideally suited for use across the ultrapure water treatment and distribution chain—including central systems, recirculation loops, and point-of-use hook-ups.

GF developed SYGEF Ultra for hot and ambient ultrapure water systems serving next-generation semiconductor technologies. The portfolio includes PEEK Pipes, PEEK Fittings and PEEK Valves (PN 16) in the following dimensions: d20; d25; d32; d50; d63; d90; d110; d160. GF has developed a tailored jointing technology, supported by integrated Quality Assurance and Quality Control (QA/QC) processes, to ensure safe, reliable, and consistent connections across the entire piping system.

Check out the SYGEF Ultra portfolio

SYGEF Ultra is delivered as a pre-fabricated solution approach:

• Installation-ready deliverables of pre-fabricated PEEK-HP pipe racks, high purity spools, skids, loop assemblies, and tool hook-ups
• In-house stress and support design optimized for cleanroom compatibility, thermal expansion, and vibration control in high purity environments.
• On-time, on-spec delivery

The high-performance system is bolstered by GF’s complete range of flow solution elements that include pipes, fittings, valves, and welding technology, engineered for ultrapure applications. 

Check out GF's Microelectronics portfolio

The rinse-down time is based on testing conducted by CT Associates under controlled conditions. The test setup included one PEEK pipe installation and two 5m PVDF-HP spools, representing typical application scenarios. All testing was performed at an UPW temperature of 85 °C.

For elaborated information on testing, please contact our experts.

PEEK (polyether ether ketone) is widely used in semiconductor applications because it combines high purity and thermal stability - all critical in ultra-clean manufacturing environments. The SYGEF Ultra system is made of a specific High Purity Polyether Ether Ketone (PEEK), a high-performance polymer that is well-known for its excellent performance in demanding industrial applications. It combines excellent mechanical strength at elevated temperatures as well as impact resistance with purity levels that exceed SEMI F57 by far. Specifically, PEEK maintains its excellent mechanical properties at continuous operating temperatures even up to 250 °C, while exhibiting a very low thermal expansion and high dimensional stability. For high purity applications, PEEK offers an exceptionally low extractables profile regarding TOC and ionic contamination as the material can be processed and used without additives. These properties make it particularly suitable for ultrapure water (UPW) and hot ultrapure water (HUPW) systems used in semiconductor manufacturing, where the highest purity standards must be maintained even at elevated temperatures and pressures.

For additional information about material behavior, please check out our Industry Planning Fundamentals. 

The increasing importance of such material performance is underscored by the International Roadmap for Devices and Systems (IRDS), which highlights ever more stringent contamination limits driven by advanced device architectures such as Gate-All-Around (GAA) and Complementary FET (CFET). As device geometries continue to shrink toward the ångström scale, impurity control requirements are tightening into the sub-ppb (parts per billion) and even ppt (parts per trillion) range.¹

¹ IRDS (2023) International Roadmap for Devices and Systems: 2023 Edition. IEEE. Available at: https://irds.ieee.org (Accessed: 5 May 2026).

The Ångström era marks the next stage in semiconductor manufacturing, where critical chip features are no longer measured in nanometers but in ångströms (Å). At this scale, transistor dimensions approach the size of individual atoms, representing the limits of extreme miniaturization. As Moore’s Law has advanced, feature sizes have steadily shrunk from micrometers to nanometers—and are now entering the ångström range.

This shift has a direct impact on UPW requirements in semiconductor fabrication. As device geometries become smaller, purity standards become significantly more stringent, while system complexity increases to ensure contamination control at near-atomic levels.

The newly introduced SYGEF Ultra system is designed to meet these evolving demands. It enables advanced semiconductor manufacturers to keep pace with industry developments such as AI-driven performance requirements, shrinking node sizes, and increasingly ambitious sustainability targets.

The term “Ångström era” was introduced by Intel in 2021 as part of its updated semiconductor process node naming, marking the transition beyond nanometer-scale technologies to angstrom-level dimensions (e.g., Intel 20A, 18A), as outlined during the company’s Intel Accelerated event.²

² Intel, “Intel Accelerated: Process and Packaging Innovations”, July 26, 2021.

The SYGEF Ultra (PEEK-HP) system has been developed in accordance with internationally recognized industry practices and design principles. As an innovative system, product-specific international standards are not yet fully established. 

SYGEF Ultra complies with:

• DIN
• DVS

In addition, the system design, testing methods, and performance requirements are based on relevant standards, like:

• ISO
• EN
• ASTM
• SEMI

For further details, please refer to our Planning Fundamentals documentation.

PFAS are defined by the Organization for Economic Co-operation and Development (OECD) [1] as “fluorinated substances that contain at least one fully fluorinated methyl or methylene carbon atom (without any H/Cl/Br/I atom attached to it), i.e. with a few noted exceptions, any chemical with at least a perfluorinated methyl group (–CF3) or a perfluorinated methylene group (–CF2–) is a PFAS.” This OECD definition is also utilized in the current version of the Annex XV restriction proposal [2] submitted under the framework of Regulation (EC) No 1907/2006 (REACH Regulation).

SYGEF Ultra is a piping system manufactured from PolyEtherEtherKetone (PEEK). The PEEK resin used for production does not meet the above OECD definition for PFAS. However, it should be noted that commonly used sealing and gasket materials such as fluoroelastomers (FKM) and polytetrafluoroethylene (PTFE) are fluorinated materials and are therefore not considered PFAS-free. Thus, SYGEF Ultra as a piping system is not considered PFAS-free.

[1] OECD (2021), Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance, OECD Series on Risk Management, No. 61, OECD Publishing, Paris. Available at: https://www.oecd.org/chemicalsafety/portal-perfluorinated-chemicals/terminology-per-and-polyfluoroalkyl-substances.pdf

[2] European Chemicals Agency (ECHA) (2023), Per- and Polyfluoroalkyl Substances (PFAS) Restriction Proposal under REACH, Restrictions under Consideration, European Chemicals Agency, Helsinki. Available at: https://echa.europa.eu/restrictions-under-consideration/-/substance-rev/72301/term